Sputter Deposited Metal Layers Embedded in Composites—From Fundamentals to Applications

F. Cougnon, M. Kersemans, W. Van Paepegem, D. Depla
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引用次数: 4

Abstract

Due to the low heat flux towards the substrate, magnetron sputter deposition offers the possibility to deposit thin films on heat sensitive materials such as fiber-reinforced polymers, also known as composite materials. Passive thermal probe measurements during the sputter deposition of metal layers show indeed that the temperature increase remains well below 25 °C for film thicknesses up to 600 nm. The latter thickness threshold is based on the influence of embedded metal films on the adhesion of the composite plies. Films thicker than this threshold deteriorate the mechanical integrity of the composite. The introduction of the uncured composite in the vacuum chamber strongly affects the base pressure by outgassing of impurities from the composite. The impurities affect the film properties as illustrated by their impact on the Seebeck coefficient of sputter deposited thermocouples. The restrictions to embed thin films in composites, as illustrated by both the heat flux measurements, and the study on the influence of impurities, are however not insurmountable. The possibility to use embedded thin films will be briefly demonstrated in different applications such as digital volume image correlation, thermocouples, and de-icing.
溅射沉积金属层嵌入复合材料-从基础到应用
由于对衬底的热流通量低,磁控溅射沉积提供了在热敏材料(如纤维增强聚合物,也称为复合材料)上沉积薄膜的可能性。在溅射沉积金属层的过程中,被动热探针测量确实表明,当薄膜厚度达到600 nm时,温度升高仍然远低于25°C。后者的厚度阈值是基于嵌入金属薄膜对复合材料层的附着力的影响。薄膜厚度超过这个阈值会降低复合材料的机械完整性。在真空室中引入未固化的复合材料会通过从复合材料中排出杂质而强烈地影响基压。杂质对溅射沉积热电偶的塞贝克系数的影响说明了杂质对薄膜性能的影响。然而,正如热流密度测量和杂质影响的研究所表明的那样,在复合材料中嵌入薄膜的限制并不是不可克服的。在不同的应用中,如数字体积图像相关、热电偶和除冰,将简要展示使用嵌入式薄膜的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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