Lingling Wang, K. Chung, Song Gao, Mingliang Ma, Jianlin Luo, Yingsong Li
{"title":"A Novel Multidirectional Strain Sensor Realized by a 3D Microstrip-Line Fed Near-Circular Patch Antenna","authors":"Lingling Wang, K. Chung, Song Gao, Mingliang Ma, Jianlin Luo, Yingsong Li","doi":"10.47037/2021.aces.j.360917","DOIUrl":null,"url":null,"abstract":"─ In this paper, we propose a newly developed impedance method to gauge the variations of multidirectional strain using a near-circular-patch based sensor. A novel three-dimensional (3D) feeding mechanism realized by a 90-deg bended microstrip line is devised for allowing strain detection along any direction in the azimuth plane of a metallic surface. The simulated results, verified by experimental results, demonstrate that there is a linear relationship between normalized impedance and multi-directional strain with high sensitivities of about 100 ppm/με. The relationship between sensitivity and sensor orientation is derived as a cosine function, which is a useful feature for estimating principal strain direction. Index Terms ─ 3D feeding mechanism, multidirectional strain monitoring, near-circular-patch, strain sensor.","PeriodicalId":8207,"journal":{"name":"Applied Computational Electromagnetics Society Journal","volume":"13 1","pages":""},"PeriodicalIF":0.6000,"publicationDate":"2021-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Computational Electromagnetics Society Journal","FirstCategoryId":"94","ListUrlMain":"https://doi.org/10.47037/2021.aces.j.360917","RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 1
Abstract
─ In this paper, we propose a newly developed impedance method to gauge the variations of multidirectional strain using a near-circular-patch based sensor. A novel three-dimensional (3D) feeding mechanism realized by a 90-deg bended microstrip line is devised for allowing strain detection along any direction in the azimuth plane of a metallic surface. The simulated results, verified by experimental results, demonstrate that there is a linear relationship between normalized impedance and multi-directional strain with high sensitivities of about 100 ppm/με. The relationship between sensitivity and sensor orientation is derived as a cosine function, which is a useful feature for estimating principal strain direction. Index Terms ─ 3D feeding mechanism, multidirectional strain monitoring, near-circular-patch, strain sensor.
期刊介绍:
The ACES Journal is devoted to the exchange of information in computational electromagnetics, to the advancement of the state of the art, and to the promotion of related technical activities. A primary objective of the information exchange is the elimination of the need to "re-invent the wheel" to solve a previously solved computational problem in electrical engineering, physics, or related fields of study.
The ACES Journal welcomes original, previously unpublished papers, relating to applied computational electromagnetics. All papers are refereed.
A unique feature of ACES Journal is the publication of unsuccessful efforts in applied computational electromagnetics. Publication of such material provides a means to discuss problem areas in electromagnetic modeling. Manuscripts representing an unsuccessful application or negative result in computational electromagnetics is considered for publication only if a reasonable expectation of success (and a reasonable effort) are reflected.
The technical activities promoted by this publication include code validation, performance analysis, and input/output standardization; code or technique optimization and error minimization; innovations in solution technique or in data input/output; identification of new applications for electromagnetics modeling codes and techniques; integration of computational electromagnetics techniques with new computer architectures; and correlation of computational parameters with physical mechanisms.