Development of a chip-based micromachined THz-spectrometer

Xiaohuan Fu, K. Attenkofer, T.T.Y. Wong
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Abstract

We present a coplanar waveguide design with integrated photoconductive transceivers; the system is fabricated on a 1.4-μm-thick SiO2/Si3N4 membrane supported by a micromachined silicon substrate. LTG GaAs is used as photon absorbing material of the photoconductive switches allowing full electron mobility at strongly reduced carrier-lifetime. By combining this circuit with a bonded sample cell, we are able to measure transmitted, reflected intensity and its phase correlations. The system was characterized by theoretical calculation and simulations.
基于芯片的微机械太赫兹光谱仪的研制
我们提出了一种集成光导收发器的共面波导设计;该系统被制作在1.4 μm厚的SiO2/Si3N4薄膜上,由微加工硅衬底支撑。LTG GaAs被用作光导开关的光子吸收材料,在大幅降低载流子寿命的情况下,允许电子完全迁移。通过将该电路与键合样品电池相结合,我们能够测量传输、反射强度及其相位相关性。通过理论计算和仿真对系统进行了表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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