{"title":"Study on new casing materials of Agaricus bisporus","authors":"김용균, 이병주, 이순계, Lee Byung Eui","doi":"10.14480/JM.2018.16.3.147","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":16539,"journal":{"name":"Journal of Mushroom","volume":"71 1","pages":"147-154"},"PeriodicalIF":0.0000,"publicationDate":"2018-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Mushroom","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.14480/JM.2018.16.3.147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}