Ashutosh Kumar Singh, B. P. Panda, S. Mohanty, S. Nayak, M. Gupta
{"title":"Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review","authors":"Ashutosh Kumar Singh, B. P. Panda, S. Mohanty, S. Nayak, M. Gupta","doi":"10.1080/03602559.2017.1354253","DOIUrl":null,"url":null,"abstract":"ABSTRACT The development of new polymer-based conductive adhesives with specific performances and improved conductivity are increasingly critical for thermally interface material (TIM). Epoxy resins have been widely used as a common interface material for conductive adhesives due to its well-known ability to accept wide range of fillers possibly derived from carbon, metallic or ceramic sources. These conductive fillers with high inherent thermal conductivity, together with a possibility to characterize and manipulate the system, leads to the production of thermally conductive adhesives with higher knowledge content for a number of electronics applications. GRAPHICAL ABSTRACT","PeriodicalId":20629,"journal":{"name":"Polymer-Plastics Technology and Engineering","volume":"58 1","pages":"903 - 934"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"27","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer-Plastics Technology and Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/03602559.2017.1354253","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"Materials Science","Score":null,"Total":0}
引用次数: 27
Abstract
ABSTRACT The development of new polymer-based conductive adhesives with specific performances and improved conductivity are increasingly critical for thermally interface material (TIM). Epoxy resins have been widely used as a common interface material for conductive adhesives due to its well-known ability to accept wide range of fillers possibly derived from carbon, metallic or ceramic sources. These conductive fillers with high inherent thermal conductivity, together with a possibility to characterize and manipulate the system, leads to the production of thermally conductive adhesives with higher knowledge content for a number of electronics applications. GRAPHICAL ABSTRACT