Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications

IF 2.8 4区 工程技术 Q2 ENGINEERING, MECHANICAL
D. Lorenzini, Wenming Li, Y. Joshi
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引用次数: 0

Abstract

Structural flexibility has become a common feature in emerging microsystems with increasing heat fluxes. The thermal control of such applications is a significant challenge because of both structural and volumetric requirements, where standard cooling solutions are not applicable. Flexible polymer microlayers are a promising solution for the embedded cooling of such microsystems. In the present investigation, a flexible polydimethylsiloxane (PDMS) microgap is proposed and assessed in an effort to prove its viability for thermal management in the aforementioned applications. The analyzed polymer microgap features a dedicated vapor pathway design which is proven to assist in the efficient removal of vapor from the microsystem. The dielectric refrigerant HFE-7100 is used as the working fluid under flow boiling conditions, reporting on the two-phase flow regime, heat transfer, and pressure drop. In addition to experimental results, the numerical modeling of the relevant features of flow boiling is explored with the use of a mechanistic phase-change model that is proven to accurately predict the flow variables and constitutes a valuable tool in the analysis and design of such microsystems. The results from this study demonstrate that this approach is feasible for the removal of relatively high heat fluxes which are comparable to metallic-based or silicon microchannels, with the added advantage of structural flexibility while also providing a stable two-phase cooling mechanism.
柔性聚合物微隙流动沸腾用于大功率嵌入式冷却
随着热通量的增加,结构灵活性已成为新兴微系统的共同特征。由于结构和体积要求,这种应用的热控制是一个重大挑战,而标准的冷却解决方案不适用。柔性聚合物微层是这类微系统嵌入式冷却的一种很有前途的解决方案。在本研究中,提出并评估了一种柔性聚二甲基硅氧烷(PDMS)微隙,以证明其在上述应用中的热管理可行性。所分析的聚合物微间隙具有专用的蒸汽通道设计,该设计已被证明有助于有效地去除微系统中的蒸汽。介质制冷剂HFE-7100被用作流动沸腾条件下的工作流体,报告了两相流状态,传热和压降。除实验结果外,本文还探索了流动沸腾相关特征的数值模拟,采用了一种机制相变模型,该模型被证明可以准确地预测流动变量,并构成了分析和设计此类微系统的宝贵工具。这项研究的结果表明,这种方法对于去除相对较高的热通量是可行的,可以与金属基或硅微通道相比较,并且具有结构灵活性的额外优势,同时还提供了稳定的两相冷却机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
自引率
0.00%
发文量
182
审稿时长
4.7 months
期刊介绍: Topical areas including, but not limited to: Biological heat and mass transfer; Combustion and reactive flows; Conduction; Electronic and photonic cooling; Evaporation, boiling, and condensation; Experimental techniques; Forced convection; Heat exchanger fundamentals; Heat transfer enhancement; Combined heat and mass transfer; Heat transfer in manufacturing; Jets, wakes, and impingement cooling; Melting and solidification; Microscale and nanoscale heat and mass transfer; Natural and mixed convection; Porous media; Radiative heat transfer; Thermal systems; Two-phase flow and heat transfer. Such topical areas may be seen in: Aerospace; The environment; Gas turbines; Biotechnology; Electronic and photonic processes and equipment; Energy systems, Fire and combustion, heat pipes, manufacturing and materials processing, low temperature and arctic region heat transfer; Refrigeration and air conditioning; Homeland security systems; Multi-phase processes; Microscale and nanoscale devices and processes.
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