{"title":"Flow Boiling in Flexible Polymer Microgaps for Embedded Cooling in High-Power Applications","authors":"D. Lorenzini, Wenming Li, Y. Joshi","doi":"10.1115/1.4056594","DOIUrl":null,"url":null,"abstract":"\n Structural flexibility has become a common feature in emerging microsystems with increasing heat fluxes. The thermal control of such applications is a significant challenge because of both structural and volumetric requirements, where standard cooling solutions are not applicable. Flexible polymer microlayers are a promising solution for the embedded cooling of such microsystems. In the present investigation, a flexible polydimethylsiloxane (PDMS) microgap is proposed and assessed in an effort to prove its viability for thermal management in the aforementioned applications. The analyzed polymer microgap features a dedicated vapor pathway design which is proven to assist in the efficient removal of vapor from the microsystem. The dielectric refrigerant HFE-7100 is used as the working fluid under flow boiling conditions, reporting on the two-phase flow regime, heat transfer, and pressure drop. In addition to experimental results, the numerical modeling of the relevant features of flow boiling is explored with the use of a mechanistic phase-change model that is proven to accurately predict the flow variables and constitutes a valuable tool in the analysis and design of such microsystems. The results from this study demonstrate that this approach is feasible for the removal of relatively high heat fluxes which are comparable to metallic-based or silicon microchannels, with the added advantage of structural flexibility while also providing a stable two-phase cooling mechanism.","PeriodicalId":15937,"journal":{"name":"Journal of Heat Transfer-transactions of The Asme","volume":"50 1","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2023-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Heat Transfer-transactions of The Asme","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4056594","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Structural flexibility has become a common feature in emerging microsystems with increasing heat fluxes. The thermal control of such applications is a significant challenge because of both structural and volumetric requirements, where standard cooling solutions are not applicable. Flexible polymer microlayers are a promising solution for the embedded cooling of such microsystems. In the present investigation, a flexible polydimethylsiloxane (PDMS) microgap is proposed and assessed in an effort to prove its viability for thermal management in the aforementioned applications. The analyzed polymer microgap features a dedicated vapor pathway design which is proven to assist in the efficient removal of vapor from the microsystem. The dielectric refrigerant HFE-7100 is used as the working fluid under flow boiling conditions, reporting on the two-phase flow regime, heat transfer, and pressure drop. In addition to experimental results, the numerical modeling of the relevant features of flow boiling is explored with the use of a mechanistic phase-change model that is proven to accurately predict the flow variables and constitutes a valuable tool in the analysis and design of such microsystems. The results from this study demonstrate that this approach is feasible for the removal of relatively high heat fluxes which are comparable to metallic-based or silicon microchannels, with the added advantage of structural flexibility while also providing a stable two-phase cooling mechanism.
期刊介绍:
Topical areas including, but not limited to: Biological heat and mass transfer; Combustion and reactive flows; Conduction; Electronic and photonic cooling; Evaporation, boiling, and condensation; Experimental techniques; Forced convection; Heat exchanger fundamentals; Heat transfer enhancement; Combined heat and mass transfer; Heat transfer in manufacturing; Jets, wakes, and impingement cooling; Melting and solidification; Microscale and nanoscale heat and mass transfer; Natural and mixed convection; Porous media; Radiative heat transfer; Thermal systems; Two-phase flow and heat transfer. Such topical areas may be seen in: Aerospace; The environment; Gas turbines; Biotechnology; Electronic and photonic processes and equipment; Energy systems, Fire and combustion, heat pipes, manufacturing and materials processing, low temperature and arctic region heat transfer; Refrigeration and air conditioning; Homeland security systems; Multi-phase processes; Microscale and nanoscale devices and processes.