Multi-Core Fiber Socket-Assisted Packaging for 84-Channel Ultra-Dense Silicon Photonics IO

2019 Optical Fiber Communications Conference and Exhibition (OFC) Pub Date : 2019-03-03 DOI:10.1364/OFC.2019.TU2A.7

G. Djogo, S. Ho, M. Haque, Erden Ertorer, Jianzhao Li, Jun Liu, Xiaolu Song, Jing Suo, P. Herman

引用次数: 3

Abstract

A femtosecond-laser 3D structured silica chip with alignment sockets has permitted precise and compact packaging of multi-core fiber for edge coupling to silicon photonic chips, with average single-pass loss of ∼5.6 dB over 84 channels.

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84通道超密硅光子IO的多核光纤插座辅助封装

一种带有对准插座的飞秒激光3D结构硅芯片，可以精确紧凑地封装多芯光纤，用于硅光子芯片的边缘耦合，84通道的平均单通损耗为~ 5.6 dB。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2019 Optical Fiber Communications Conference and Exhibition (OFC)

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