Operator Perspective: How to Choose between the RIS and Full/Half-Duplex Relay

Yuetian Zhou, Fang Nan, Lei Gao
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Abstract

A potential 6G technology called Reconfigurable Intelligent Surface (RIS) uses meta-surface to reflect the signal to the user. The usage of RIS as a passive full-duplex relay to support wireless communication is a strong one because of its distinctive qualities of low cost, low energy consumption, excellent reliability, and big capacity. At the same time, the related technology active full-duplex relay which evolves from traditional half-duplex relay is also a candidate 6G technology. Both RIS and full/half-duplex relay is a node between source and destination to improve the performance of system, so how to choose between them? In this study, we examine the two technologies' performance from the viewpoint of the operators. In order to make the comparison fair, an evaluated model is proposed, and we get the closed expression of achieved rates for RIS and active relay to provide a deterministic calculation for the comparison. The results show that both RIS and full-duplex active relay are effective for the performance improvement, which of the two has the higher achieved rates is determined by the element number of RIS and the self-interference suppression of full-duplex relay.
操作员视角:如何在RIS和全/半双工中继之间进行选择
一种潜在的6G技术称为可重构智能表面(RIS),它使用元表面将信号反射给用户。RIS作为无源全双工中继支持无线通信,具有成本低、能耗低、可靠性好、容量大等特点。同时,由传统半双工中继演变而来的有源全双工中继相关技术也是6G的候选技术。RIS和全/半双工中继都是提高系统性能的源和目的之间的节点,那么如何在它们之间进行选择呢?在本研究中,我们从运营商的角度来考察这两种技术的性能。为了使比较公平,提出了一种评估模型,得到了RIS和有源继电器的完成率的封闭表达式,为比较提供了确定性计算。结果表明,RIS和全双工有源中继都能有效提高系统的性能,RIS的单元数和全双工中继的自干扰抑制能力决定了哪一种有源中继的实现速率更高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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