Numerical simulation of dry and wet oxidation of Silicon by TCAD Sprocess

A. Anusha, Chithra Parameswaran, P. Revathi, V. Velmurugan
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引用次数: 2

Abstract

The oxide thickness is of great concern today. The basic idea is to grow SiO2 layer on Silicon. The oxide is grown on intrinsic silicon substrate by thermal oxidation i.e., wet oxidation and dry oxidation. The thickness is compared for both the oxidation processes after different oxidation cycles. The capacitance per unit length is also calculated for the oxide growth in above. The percentage oxide thickness is also estimated and the oxide is found to grow more into the substrate with time and number of cycles.
硅干、湿氧化TCAD过程的数值模拟
氧化物的厚度是当今人们非常关注的问题。基本原理是在硅上生长SiO2层。氧化物是通过热氧化,即湿氧化和干氧化在本质硅衬底上生长的。对两种氧化工艺经过不同氧化循环后的厚度进行了比较。单位长度的电容也计算了上面的氧化物生长。我们还估计了氧化物厚度的百分比,发现随着循环时间和次数的增加,氧化物在衬底中生长得更多。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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