Evaluation of Oxide Thin Film Layers Prepared by Sputtering

E. Horynová, I. Pelikánová
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Abstract

Thin film layers are used in a wide range of fields (microchips, solar cells, etc.)because of the high dependency of their properties on the thickness of the layer. It is important to know how to achieve different thickness and quality of the layers by changing conditions of deposition. Samples of oxide thin film layers were prepared by magnetron sputtering. Two different materials were used - aluminum oxide and zinc oxide. Effect of different conditions (time and power of plasma)during the deposition was observed. The samples were evaluated from a few different points of view. Firstly, the thickness and capacity of each layer were measured. Thickness was also calculated from capacity and then compared to measured values. As expected, thickness increased with increasing time of deposition and with the increasing power of plasma during the deposition. Detail images of the layers were captured by an optical microscope and these images were processed in order to measure grain size. Average grain size was increasing with higher power during the deposition.
溅射法制备氧化薄膜层的评价
薄膜层被广泛应用于许多领域(如微芯片、太阳能电池等),因为它们的特性高度依赖于薄膜层的厚度。了解如何通过改变沉积条件来获得不同厚度和质量的层是很重要的。采用磁控溅射法制备了氧化薄膜层样品。使用了两种不同的材料——氧化铝和氧化锌。观察了沉积过程中不同条件(等离子体时间和功率)的影响。这些样本从几个不同的角度进行了评估。首先,测量了每一层的厚度和容量。厚度也由容量计算,然后与测量值进行比较。正如预期的那样,厚度随着沉积时间的增加和等离子体功率的增加而增加。用光学显微镜捕获了这些层的详细图像,并对这些图像进行了处理,以测量晶粒尺寸。平均晶粒尺寸随功率增大而增大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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