Numerical Investigation of Interfacial Stress Distribution in Adhesive-Bonded Joints for Different Adhesive Materials

S. Somadder, Palash Das, Md Ashraful Islam, Md. Abdul Hasib
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Abstract

The widespread use of adhesive bonded connections has been used in a range of technical fields. In this paper, the interfacial stress distribution of adhesive bonded joint is presented. When determining whether or not a structure is dependable for use in operation, the stresses that act along the bond line of an adhesively bonded lap joint are of the utmost importance. The purpose of this study is to develop finite element solutions that are able to anticipate shear and peel stresses using the theory of elasticity as their foundation. The effect of adhesive properties on stress distribution is investigated by using different adhesive materials. By analysing five different adhesive materials it is concluded that ‘adhesive I’ is more reliable for operation.
不同粘结材料粘结接头界面应力分布的数值研究
胶粘剂粘合连接的广泛应用已在一系列技术领域得到应用。本文介绍了粘接接头的界面应力分布。当确定一个结构在操作中是否可靠时,沿粘合搭接接头的粘合线作用的应力是最重要的。本研究的目的是利用弹性理论作为基础,开发能够预测剪切和剥离应力的有限元解决方案。采用不同的胶粘剂材料,研究了胶粘剂性能对应力分布的影响。通过对5种不同粘结材料的分析,得出了“粘结剂I”更可靠的结论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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