Optimization and Characterization of Phosphorus Diffused LPCVD Polysilicon Passivated Contacts with Low Pressure Tunnel Oxide

K. Fong, T. Kho, Wensheng Liang, T. Chong, M. Ernst, D. Walter, M. Stocks, E. Franklin, K. McIntosh, A. Blakers
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引用次数: 1

Abstract

This work presents the investigation of low pressure in-situ thermal oxidation as the interfacial oxide for n+ polysilicon-oxide passivated contact structure, achieving excellent surface passivation below 1 fA·cm-2 and contact resistivity below 1 mΩ·cm2. The results from the process optimisation are presented in detail, showing the importance of accurate control of oxidation conditions, and presenting the correlation to the electrical properties. Additionally, a method of fabricating contact resistivity structures from symmetrical photoconductance decay lifetime samples, and the extraction of the specific contact resistivity using 3D numerical simulation is presented.
磷扩散LPCVD多晶硅低压隧道氧化物钝化触点的优化与表征
本文研究了低压原位热氧化作为n+多晶硅钝化接触结构的界面氧化物,获得了低于1 fA·cm-2的良好表面钝化效果和低于1 mΩ·cm2的接触电阻率。详细介绍了工艺优化的结果,显示了准确控制氧化条件的重要性,并展示了与电性能的相关性。此外,提出了一种利用对称光导衰减寿命样品制作接触电阻率结构的方法,并利用三维数值模拟方法提取了比接触电阻率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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