The study on the moldability and reliability of epoxy molding compound

Abstract

In this paper, different type of wax, wax content and hot hardness at 175°C on the release force and adhesion of molding compound were studied, The studies reveal that the hot hardness is playing a very important role to balance the conflict of reliability and moldability. With higher hot hardness of epoxy molding compound, the release force can be kept at same level with less wax content which can increase the adhesion significantly. To achieve the high reliability and long moldability, the best wax content should be near 0.2 and the hot hardness should be larger than 85.