A fast and low-cost TSV/TGV filling method

Abstract

In this paper, we present an alloy via-filling method that does not need pre-metallization of via holes and can be realized on wafer level. Through-Silicon Via(TSV)/Through Glass Via(TGV) with different geometries can be filled simultaneously in few minutes, instead of few hours by electroplating. A specific equipment is made for the alloy via-filling method. The alloy TSV filling method presented in this paper has the potential for industrial applications.