Crosstalk improved three channel receiver module for 10 Gb/s parallel optical interconnect application

Sang Hyun Park, C. Park
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Abstract

Three channel optical receiver array with low inter-channel crosstalk is realized with InGaP/GaAs HBT technology and 3D multilayer low temperature cofiring ceramics (LTCC) module. The severe crosstalk in conventional on-chip bus module is explained especially at the frequency of 10 GHz. Neutralization feedback circuit with LTCC embedded bus structure is proposed to suppress significant high frequency crosstalk from conventional on-chip bus and inter-metallic capacitance. This new module structure demonstrates 5 dB better suppressed-coupling than a conventional on-chip bus module.
用于10gb /s并行光互连应用的串扰改进三通道接收模块
采用InGaP/GaAs HBT技术和三维多层低温共烧陶瓷(LTCC)模块实现了低通道间串扰的三通道光接收机阵列。分析了传统片上总线模块在10ghz频率下存在的严重串扰问题。提出了LTCC嵌入式母线结构的中和反馈电路,以抑制传统片上母线和金属间电容产生的高频串扰。与传统的片上总线模块相比,这种新型模块结构的抑制耦合性能提高了5 dB。
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