Permittivity in Epoxy based Syntactic Foam Nanocomposites

T. Andritsch, A. Lunding, P. Morshuis, H. Negle, J. Smit
{"title":"Permittivity in Epoxy based Syntactic Foam Nanocomposites","authors":"T. Andritsch, A. Lunding, P. Morshuis, H. Negle, J. Smit","doi":"10.1109/CEIDP.2008.4772892","DOIUrl":null,"url":null,"abstract":"Following previous work, this paper focuses on a new type of epoxy based syntactic foam, a lightweight material which is known to electrical engineering since the seventies, but so far couldn't live up to it's potential in high voltage applications. This is mainly because of the basic structure of syntactic foam, which provides closed cell porosity. The porosity, which gives syntactic foam its weight reduction, unfortunately leads to shortcomings in terms of dielectric strength and PD resistance. However: with recent advances in material science and the dawn of nanotechnology, there is a new take on this unique material, which can be used as insulating material for HV-applications, where weight is of vital importance. Four different types of epoxy based syntactic foam nanocomposites are presented, whose respective dielectric behavior were studied with help of dielectric spectroscopy. The measurement results, with emphasis on the complex permittivity, are presented in this work. Also the advantages and shortcomings of the various composites are discussed, as they are compared with both unmodified syntactic foam, as well as the unmodified base epoxy.","PeriodicalId":6381,"journal":{"name":"2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":"12 1","pages":"513-516"},"PeriodicalIF":0.0000,"publicationDate":"2008-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CEIDP.2008.4772892","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

Following previous work, this paper focuses on a new type of epoxy based syntactic foam, a lightweight material which is known to electrical engineering since the seventies, but so far couldn't live up to it's potential in high voltage applications. This is mainly because of the basic structure of syntactic foam, which provides closed cell porosity. The porosity, which gives syntactic foam its weight reduction, unfortunately leads to shortcomings in terms of dielectric strength and PD resistance. However: with recent advances in material science and the dawn of nanotechnology, there is a new take on this unique material, which can be used as insulating material for HV-applications, where weight is of vital importance. Four different types of epoxy based syntactic foam nanocomposites are presented, whose respective dielectric behavior were studied with help of dielectric spectroscopy. The measurement results, with emphasis on the complex permittivity, are presented in this work. Also the advantages and shortcomings of the various composites are discussed, as they are compared with both unmodified syntactic foam, as well as the unmodified base epoxy.
环氧基复合泡沫纳米复合材料的介电常数
继之前的工作之后,本文重点研究了一种新型环氧基复合泡沫材料,这种轻质材料自70年代以来就被电气工程所熟知,但到目前为止还不能发挥其在高压应用中的潜力。这主要是因为句法泡沫的基本结构,它提供闭孔孔隙率。多孔性使复合泡沫减轻了重量,但不幸的是,它在介电强度和抗PD性方面存在缺点。然而,随着材料科学的最新进展和纳米技术的曙光,这种独特的材料有了新的发展,它可以用作高压应用的绝缘材料,在这些应用中,重量是至关重要的。提出了四种不同类型的环氧基复合泡沫材料,并利用介电光谱对其介电性能进行了研究。本文给出了复合介电常数的测量结果。讨论了各种复合材料的优缺点,并将其与未改性的复合泡沫和未改性的基型环氧树脂进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信