Micro-Hermetic Packaging Technology for Active Implantable Neural Interfaces

Abstract

In this paper, we propose a fused silica packaging platform with a micro-cavity designed to house and protect active electronics for neural interfaces. Proof-of-concept test vehicles were specifically designed, fabricated, and packaged in order to evaluate the ability of the packaging to protect against water and ion incursion. Accelerated degradation testing of three test vehicles in physiological saline was performed in a custom-built encapsulation test system (ETS) at 57 °C for 16 days (nominally equivalent to 68 days at 37 °C). Leakage current, as well as gross functionality of the test circuit, was evaluated and is presented as preliminary results.