Design simulation and fabrication of 3D electrode for dielectrophoretic chip

Abstract

This paper presents the design, simulation and fabrication of dielectrophoretic chip with integrated nickel 3D electrodes for bioparticle separation. Finite element analysis software COMSOL Multyphysics 4.3 is used to measure the electric field distribution and also the temperature profile inside the microfluidic channel. The temperature rise is found to be 0.5 K. Electric field distribution shows almost uniform electric field on XY plane at different Z axis. Fabrication of 3D nickel electrode is accomplished using electroplating process. 3D sidewall dielectrophoretic chip reduces the electrochemical effect and joule heating effect.