Correction: Recent Advances in Thermal Interface Materials

Abstract

Yongcun Zhou,1,2,* Siqi Wu,1 Pengli Zhu,3 Feixiang Wu4 and Feng Liu1,5 Vignesh Murugadoss,6,7 Williams Winchester,8 Amit Nautiyal,8 Zhe Wang8,* and Zhanhu Guo7,* 1School of Material Science and Engineering, Northwestern Polytechnical University, Xi’an 710072, China 2Yangtze River Delta Research Institute of NPU, Taicang 215400, China Shenzhen Institute of Advanced Electronic Materials, Shenzhen Fundamental Research Institutions, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China 4School of Metallurgy and Environment, Central South University, Changsha 410083, China Analytical & Testing Center, Northwestern Polytechnical University, Xi’an 710072, China Electro-Materials Research Laboratory, Centre for Nanoscience and Technology, Pondicherry University, Puducherry 605014, India Integrated Composites Laboratory (ICL), Department of Chemical and Biomolecular Engineering, University of Tennessee, Knoxville, TN 37996, USA Chemistry Department, Xavier University of Louisiana, New Orleans 70125, USA *E-mail: yczhou@nwpu.edu.cn; zwang@xula.edu; zguo10@utk.edu, nanomaterials2000@gmail.com