Molecular Dynamics Simulations of Self-Assembled Polyethylene-Hexagonal Boron Nitride Composite and Its Thermal Conductivity

One-Sun Lee, Mehamed Ali, A. Mabrouk, Ahmed A Abdala
{"title":"Molecular Dynamics Simulations of Self-Assembled Polyethylene-Hexagonal Boron Nitride Composite and Its Thermal Conductivity","authors":"One-Sun Lee, Mehamed Ali, A. Mabrouk, Ahmed A Abdala","doi":"10.1109/IRSEC48032.2019.9078254","DOIUrl":null,"url":null,"abstract":"The demand of the heat dissipating polymer-based composites is increasing because of the processibility, light weight, corrosion resistance, and low cost of polymers regardless of their low thermal conductivity. It is well known that 3-dimensional arrangement and the relative orientation of the filler particles with high thermal conductivity significantly influence the composite thermal conductivity. To study the relation between the composite internal structure and the thermal conductivity, we developed the atomistic model and measure the thermal conductivity of composites. The self-assembled structure of the composite composed of polyethylene (PE) matrix and hexagonal boron nitride (hBN) sheets is obtained at the atomistic level using annealing molecular dynamics simulations. We found that the hBN sheets prefer a stacked structure because of strong electrostatic interactions, and they form a segregated domain inside the polymer matrix. The effect of hBN concentration on the thermal conductivity is calculated and were found to be in good agreement with the experimental results.","PeriodicalId":6671,"journal":{"name":"2019 7th International Renewable and Sustainable Energy Conference (IRSEC)","volume":"26 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 7th International Renewable and Sustainable Energy Conference (IRSEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRSEC48032.2019.9078254","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The demand of the heat dissipating polymer-based composites is increasing because of the processibility, light weight, corrosion resistance, and low cost of polymers regardless of their low thermal conductivity. It is well known that 3-dimensional arrangement and the relative orientation of the filler particles with high thermal conductivity significantly influence the composite thermal conductivity. To study the relation between the composite internal structure and the thermal conductivity, we developed the atomistic model and measure the thermal conductivity of composites. The self-assembled structure of the composite composed of polyethylene (PE) matrix and hexagonal boron nitride (hBN) sheets is obtained at the atomistic level using annealing molecular dynamics simulations. We found that the hBN sheets prefer a stacked structure because of strong electrostatic interactions, and they form a segregated domain inside the polymer matrix. The effect of hBN concentration on the thermal conductivity is calculated and were found to be in good agreement with the experimental results.
自组装聚乙烯-六方氮化硼复合材料的分子动力学模拟及其导热性能
尽管聚合物的导热系数较低,但由于其易加工、重量轻、耐腐蚀和低成本等优点,对聚合物基复合材料的需求正在增加。众所周知,高导热填料颗粒的三维排列和相对取向对复合材料的导热性能有显著影响。为了研究复合材料内部结构与导热系数之间的关系,我们建立了复合材料的原子模型并测量了复合材料的导热系数。通过退火分子动力学模拟,在原子水平上得到了聚乙烯(PE)基体与六方氮化硼(hBN)片复合材料的自组装结构。我们发现,由于强静电相互作用,hBN片倾向于堆叠结构,它们在聚合物基体内形成一个分离的区域。计算了hBN浓度对导热系数的影响,结果与实验结果吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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