Reliability Analysis of a New Soldering Process For Automotive Power Modules Application

微纳电子与智能制造 Pub Date : 2006-04-24 DOI:10.1109/ESIME.2006.1643973

R. Mathieu, W. Eric, A. Stephane

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引用次数: 2

Abstract

This paper presents a reliability study of power assemblies based on the correlation of finite element simulations and experimental results. For these power modules, a new process was used to solder bare dice on a copper lead frame with a local heating source. The reliability methodology we are using is based on the evaluation of the strain energy density accumulated in the solder joint during the lifetime of the assembly. The study was also carried out on various types of solder. Two series of simulations have been carried out in parallel. The first series was the simulation of a classical reflow process with a uniform temperature of 300degC in the whole assembly. The second one was the simulation of the new process with localized heating. The comparison of the results of the simulations allowed concluding that this new process does not introduce more strain than a normal process. In order to evaluate the lifetime of the assembly, ageing tests have been carried out on representative test vehicles. By correlation between simulations and ageing tests, we have evaluated the lifetime of the assembly under operation conditions

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一种新型汽车电源模块焊接工艺的可靠性分析

本文在有限元仿真与实验结果相结合的基础上，对动力总成的可靠性进行了研究。对于这些电源模块，采用了一种新的工艺，在带有局部热源的铜引线框架上焊接裸片。我们使用的可靠性方法是基于在装配寿命期间焊点累积的应变能密度的评估。对不同类型的焊料也进行了研究。两组模拟并行进行。第一个系列是模拟一个经典的回流过程，整个组件的均匀温度为300摄氏度。第二部分是局部加热新工艺的模拟。通过对模拟结果的比较，可以得出这样的结论:这种新工艺并不比普通工艺引入更多的应变。为了评估该总成的寿命，在具有代表性的试验车上进行了老化试验。通过仿真与老化试验的关联，我们评估了该组件在运行条件下的寿命

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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微纳电子与智能制造

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