New type of large-area a-Si module produced using a polymer encapsulation method

Abstract

A new type of amorphous silicon (a-Si) solar module has been developed, the back surface of which is encapsulated with a thermosetting polymer by using a spreading method. For this purpose, poly-olefin oligomer was chosen as an encapsulation layer and the process has been investigated. The modules show very little change in electrical performance under several types of acceleration test.