Ab initio screening of metallic MAX ceramics for advanced interconnect applications

K. Sankaran, K. Moors, Z. Tokei, C. Adelmann, G. Pourtois
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引用次数: 11

Abstract

The potential of a wide range of layered ternary carbide and nitride MAX phases as conductors in interconnect metal lines in advanced CMOS technology nodes has been evaluated using automated first principles simulations based on density functional theory. The resistivity scaling potential of these compounds, i.e. the sensitivity of their resistivity to reduced line dimensions, has been benchmarked against Cu and Ru by evaluating their transport properties within a semiclassical transport formalism. In addition, their cohesive energy has been assessed as a proxy for the resistance against electromigration and the need for diffusion barriers. The results indicate that numerous MAX phases show promise as conductors in interconnects of advanced CMOS technology nodes.
用于高级互连应用的金属MAX陶瓷从头开始筛选
利用基于密度泛函理论的自动化第原理模拟,评估了各种层状三元碳化物和氮化物MAX相作为先进CMOS技术节点互连金属线导体的潜力。这些化合物的电阻率标度势,即其电阻率对减小线尺寸的敏感性,通过在半经典输运形式下评估其输运性质,以Cu和Ru为基准。此外,它们的内聚能被评估为抵抗电迁移和需要扩散屏障的代理。结果表明,大量的MAX相在先进CMOS技术节点的互连中具有广阔的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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