Frameworks for direct bonding

Jan Haisma, Gijsbertus A.C.M. Spierings, Theo M. Michielsen
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引用次数: 7

Abstract

The spontaneous formation of a direct bond between materials — a phenomenon sometimes encountered in mechanics and optics — was considered inconvenient at first. It was some time before the advantages of the possibility of realizing direct bonds were realized: direct bonds obviated the need for intermediate adhesive layers. A good deal of research had to be done into the required pretreatment of the material parts and the aftertreatment for bond tightening before direct bonding could be used as a technology.

Geometrical, mechanical, chemical and physical properties of the materials involved all play a part in the formation of a direct bond; they are collectively referred to as the physiognomic properties. This chapter will describe a number of examples demonstrating the wide variety of materials (both inorganic and organic) that can be directly bonded, after which some magnetic, electric and electromagnetic advantages of directly bonded, electromagnetically active materials will be briefly outlined.

直接键合框架
材料间直接键的自发形成——在力学和光学中有时会遇到这种现象——起初被认为是不方便的。过了一段时间,人们才意识到实现直接粘合的可能性的优势:直接粘合不需要中间粘合层。在直接粘合作为一项技术使用之前,必须对材料部件所需的预处理和粘合紧固的后处理进行大量的研究。所涉及的材料的几何、机械、化学和物理性质都对直接键的形成起作用;它们统称为面相属性。本章将描述一些例子,展示各种各样的材料(无机和有机),可以直接键合,之后,一些直接键合,电磁活性材料的磁性,电学和电磁优势将简要概述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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