Optimizations for Heat Dissipation Strategies on PC Motherboards

Abstract

The present paper aims to study the efficiency of the classical cooling method used for dissipating power from microprocessors: a fan placed on top of a heat sink and the impact this setup has on the surrounding thermally critical components placed near the CPU. It then suggests a better placement of the fan in order to define a safe area in which these components could be placed, without impacting the efficiency of heat extraction.