Туннелирование через барьеры Шоттки Ni/n-GaN по локализованным состояниям дефектов

Н.И. Бочкарева, Ю.Г. Шретер
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Abstract

Schottky barriers on GaN is considered on the basis of an analysis of the features of the current-voltage characteristics of Ni/n-GaN diodes. It is found that the forward I–V characteristics on a semilogarithmic scale have the form of curves with steps at biases corresponding to the Gaussian bands of localized states of defects in the GaN band gap. It is shown that the experimental current-voltage characteristics are in agreement with a simple physical model that takes into account the thinning of the Schottky barrier due to the space charge of ionized deep centers, which stimulates the concentration of the electric field near the Schottky contact and tunneling of electrons by hopping between local centers through the near-contact layer. At forward biases, this causes an exponential increase in the tunneling current of electrons thermally activated to an energy corresponding to the peak of the Gaussian band. The recharging of the states of the Gaussian band is accompanied by a decrease in the probability of tunneling and the appearance of a current plateau on the forward lg I(Vj) curves. An increase in the space charge of deep centers under reverse bias leads to tunneling leakage and limits the breakdown voltage.
通过Ni/n-GaN壁垒隧道
在分析Ni/n-GaN二极管电流-电压特性的基础上,提出了氮化镓上的肖特基势垒。发现在半对数尺度上的正演I-V特性具有与GaN带隙中缺陷局域态高斯带相对应的阶跃偏差曲线形式。实验结果表明,电流-电压特性与一个简单的物理模型是一致的,该模型考虑了由于电离深中心的空间电荷而导致的肖特基势垒变薄,这刺激了肖特基接触附近电场的集中和电子通过近接触层在局部中心之间跳跃而穿隧。在正向偏置下,这导致热激活电子的隧穿电流呈指数增长,达到高斯带峰值对应的能量。高斯带态的再充电伴随着隧穿概率的降低和正向lg I(Vj)曲线上电流平台的出现。在反向偏压下,深中心空间电荷的增加会导致隧穿泄漏并限制击穿电压。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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