Simulating the stress-strain state of a thin plate after a thermal shock

Abstract

The paper is devoted to simulating the impact of a thermal shock on a thin homogeneous plate in the ANSYS package. The assessment of the stress–strain state is carried out and the dynamics of changes in the temperature field of the plate is determined. The obtained results were compared with the data of other authors and can be used when taking into account the thermal shock of large elastic elements of spacecraft.