Studies on Thermal Conductivity Measurement of Granular Materials in System of Solid-Fluid Mixture

K. Hayashi, Tomozo Nishikawa, Isao Uei
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Abstract

The hot wire method has been used to measure thermal conductivity of massive solid materials. In order to find out a suitable way to measure thermal conductivity of granular solid materials, Ks, by hot wire method, the authors have examined the thermal conductivity measurement about the system of dispersed granular solid materials into a solid dispersion medium like silicon rubber. However, there were some limitations in the method that silicon rubber didn't work well at higher temperatures than 300°C and the rubber penetrated into the pore of granular solid materials in some cases. In this research, the authors tried to use some fluids to be applicable at higher temperatures and not to react with granular solid materials, and developed a method to be able to calculate Ks from gross thermal conductivity of granular solid-fluid mixture, K, and that of Kf.For the calculation of Ks from K and Kf, de Vries'equation was reasonably applied to both spherical and irregular-shaped particles. The shape factors Gi included in de Vries'equation were found to vary with the surface area of the granular solid materials in the case of spherical particles, but was almost constant in the irregular shaped particles.They wereG1=G2=5.34×10-4S+0.0374 G3=-1.07×10-3S+0.925} for spherical particle, G1=G2=0.05, G3=0.90 for irregular shaped particle, where S is surface area (cm2/cm3)The reliability of the results obtained by the application of de Vries' equation increased with the use of fluid having higher thermal conductivity. For example, when helium gas with thermal conductivity of 3.65×10-4cal/cm⋅sec⋅°C was used, the error of the obtained values Ks of 3.25×10-3 and 1.4×10-2cal/cm⋅sec⋅°C were about 4% and 8%, respectively.In view of the fact that the error increased with increasing thermal conductivity of granular solid materials to be measured, this method can be applied to the solid materials having thermal conductivity of smaller than about 1.5×10-2cal/cm⋅sec⋅°C, if the error of ±10% is allowable.
固体-流体混合体系中颗粒物料导热系数测量的研究
热丝法已被用于测量块状固体材料的导热系数。为了寻找一种适合于用热丝法测量颗粒状固体材料Ks导热系数的方法,本文对颗粒状固体材料在硅橡胶等固体分散介质中的分散体系导热系数的测量进行了研究。然而,该方法存在一定的局限性,硅橡胶在300℃以上的高温下不能很好地工作,在某些情况下,橡胶会渗透到颗粒状固体材料的孔隙中。在本研究中,作者尝试使用一些适用于较高温度且不与颗粒状固体材料发生反应的流体,并开发了一种能够通过颗粒状固体-流体混合物的总导热系数K和Kf计算Ks的方法。对于由K和Kf计算K, de Vries方程合理地适用于球形和不规则形状的粒子。de Vries方程中的形状因子Gi在球形颗粒的情况下随颗粒状固体材料表面积的变化而变化,而在不规则颗粒的情况下几乎是恒定的。对于球形颗粒为eg1 =G2=5.34×10-4S+0.0374 G3=-1.07×10-3S+0.925},对于不规则形状颗粒为G1=G2=0.05, G3=0.90,其中S为表面积(cm2/cm3)。使用导热系数较高的流体,应用de Vries方程所得结果的可靠性提高。以导热系数为3.65×10-4cal/cm·sec·°C的氦气为例,3.25×10-3和1.4×10-2cal/cm·sec·°C的k值误差分别为4%和8%左右。考虑到误差随待测颗粒状固体材料导热系数的增大而增大,在允许误差为±10%的情况下,该方法可应用于导热系数小于1.5×10-2cal/cm⋅sec⋅°C左右的固体材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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