Future memory and interconnect technologies

Yuan Xie
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引用次数: 36

Abstract

The improvement of the computer system performance is constrained by the well-known memory wall and power wall. It has been recognized that the memory architecture and the interconnect architecture are becoming the overwhelming bottleneck in computer performance. Disruptive technologies, such as emerging non-volatile memory (NVM) technologies, 3D integration, and optical interconnects, are envisioned as promising future memory and interconnect technologies that can fundamentally change the landscape of the future computer architecture design with profound impact. This invited survey paper gives a brief introduction of these future memory and interconnect technologies, discusses the opportunities and challenges of these new technologies for future computer system designs.
未来的存储器和互连技术
计算机系统性能的提高受到众所周知的内存墙和功耗墙的制约。人们已经认识到,内存体系结构和互连体系结构正在成为计算机性能的压倒性瓶颈。颠覆性技术,如新兴的非易失性存储器(NVM)技术、3D集成和光互连,被认为是有前途的未来存储器和互连技术,可以从根本上改变未来计算机架构设计的格局,并产生深远的影响。本文简要介绍了这些未来的存储器和互连技术,讨论了这些新技术对未来计算机系统设计的机遇和挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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