Environmental Influence on Fracture and Delamination of Electrically Conductive Adhesives

Abstract

This paper presents our continued work on developing a degradation model for electrically conductive adhesive (ECA) interconnects in photovoltaic modules. Here, we characterize the fracture mechanics properties of an epoxy based ECA, for both critical and subcritical loading conditions. Emphasis is put on the influence of different environmental conditions such as temperature and humidity. We found that high levels of humidity not only weaken the adhesive joint but also promote subcritical debonding at significantly lower driving forces than in dry environments.