Warpage simulation method development considering moiré inhomogeneous temperature field

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI:10.1109/ICEPT47577.2019.245313

Zhen Wang, Shengxiang Li, Yonghua Zhou, Xiaoqing Li, Junling Wu, Qiang Chen

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Abstract

In this paper, warpage simulation method considering moiré inhomogeneous temperature field is proposed. Shadow moiré is an optical technique for measuring warpage. For moiré inner heating element structure, there is inhomogeneous temperature-field in heating process and the maximum temperature gap at different locations in the same substrate is about 40°C Substrate warpage and inhomogeneous temperatur field impact each other. For previous research about moiré measured results, the influence of inhomogeneous temperature field is not considered. Base of ICEPAK (thermal analysis software) and ABAQUS (structural analysis software), thermal-structural coupled method is studied. According actual temperature field, ICEPAK is used to simulate the moiré cavity thermal radiation temperature field. Moiré temperature field formula is fitted and the fitted formula is used as temperature boundary conditions in ABAQUS to simulate substrate warpage in moiré. Using this method, it is found that warpage simulation result matches well with the moiré measured data and the accuracy of simulation is improved by nearly 50%.

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考虑气流非均匀温度场的翘曲模拟方法的发展

本文提出了一种考虑气流非均匀温度场的翘曲模拟方法。阴影扫描是一种测量翘曲的光学技术。对于波纹内加热元件结构，加热过程中存在不均匀温度场，同一衬底不同位置的最大温度差约为40℃，衬底翘曲和不均匀温度场相互影响。以往对波纹测量结果的研究没有考虑非均匀温度场的影响。以ICEPAK(热分析软件)和ABAQUS(结构分析软件)为基础，研究了热-结构耦合方法。根据实际温度场，利用ICEPAK软件对涡流腔热辐射温度场进行了模拟。拟合了波纹温度场公式，并将拟合公式作为ABAQUS中的温度边界条件，模拟波纹中衬底翘曲。应用该方法，翘曲仿真结果与实测数据吻合较好，仿真精度提高了近50%。

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2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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