Comprehensive Simulation and Design of 3D Silicon Sensors for Enhanced Timing Performance

A. Loi, A. Lai, A. Contu, A. Cardini, A. Lampis, M. Garau, D. Brundu, G. Cossu, G. Betta, G. Forcolin, R. Mendicino, C. Bozzi, B. Siddi, S. Vecchi
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Abstract

This paper presents the procedure developed and used within the TimeSPOT (for Time and Space real time Operating Tracker) project to design and characterise 3D silicon sensors with enhanced timing capabilities. Such procedure is based on the combined use of commercial (TCAD), semi-custom (GEANT4) and custom (TCoDe) software tools which allow to fully design and simulate the device, from the definition of doping profiles and concentrations to the description of the charge carriers transportation mechanisms and the calculation of the induced current signals, which are input to the front-end electronics. A very important feature of the procedure is its speed in the most time-consuming part, that is the calculation of the carriers transportation phenomena inside the sensor volume. This allows to routinely perform analyses based on several thousand of signals, thus giving a statistically significant description of the detection mechanisms and the possibility to compare simulation and experimental results. The design study has been decisive to obtain a 3D silicon sensor with time resolutions well below 30 ps. The procedure is in principle extendable to any kind of solid state sensors.
提高三维硅传感器时序性能的综合仿真与设计
本文介绍了在TimeSPOT(时间和空间实时操作跟踪器)项目中开发和使用的程序,用于设计和表征具有增强定时功能的3D硅传感器。该程序基于商业(TCAD),半定制(GEANT4)和定制(TCoDe)软件工具的组合使用,允许完全设计和模拟设备,从掺杂轮廓和浓度的定义到电荷载流子传输机制的描述和感应电流信号的计算,这些信号输入到前端电子设备。该方法的一个重要特点是在最耗时的部分,即传感器体积内载流子输运现象的计算中速度快。这允许基于数千个信号进行常规分析,从而给出检测机制的统计意义描述,并有可能比较模拟和实验结果。设计研究对于获得时间分辨率远低于30 ps的3D硅传感器具有决定性作用。该过程原则上可扩展到任何类型的固态传感器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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