Dynamic analysis on supporting structure of air borne vehicle subjected to random vibrations

Mailaram Gunashekar, M. Rakesh, K. S. K. Reddy, Y. V. Narayana
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Abstract

The design of electronic component plays a crucial role in proper functioning of the missile. Vibration is one of the most important loading conditions in electronic systems at different phases such as transportation, handling, captive carry flight and free flight. Unless an electronic system is designed to function in its dynamic environment, there can be many structural problems that may require an extensive amount of redesign and re-testing. Electronic systems are actually subjected to three different phases of dynamic or vibration environment. The first phase is during manufacturing or screening test, the second is during transportation from assembly to plant to the customer and the final phase is in the operational environment. The different components such as electronic components and supporting structure undergo random vibrations resulting in malfunctioning of the system. Since the entire electronic components are mounted on chassis which is supported by the supporting structure, it is vital to ensure its proper design to resist dynamic effects when exposed to vibration environment. Analysis of dynamics of a complete system and interactions between each level is required in order to obtain a complete system model which leads to the solution of vibration problem.The design of electronic components is based on the requirements of the missile. In this project, supporting structure is modified by changing mounting bars and mounting plates. These structures are designed by integrating bars and plate. The aim of this project is to design these structures and perform random vibration analysis individually in ANSYS, to analyse the effects of random vibration on these supporting structures and determine the best supporting structure which reduces the effects of random vibration on the electronic components.
随机振动作用下飞行器支承结构的动力学分析
电子元件的设计对导弹的正常工作起着至关重要的作用。振动是电子系统在运输、装卸、强制携带飞行和自由飞行等不同阶段最重要的载荷条件之一。除非电子系统被设计成在其动态环境中工作,否则可能存在许多结构问题,可能需要大量的重新设计和重新测试。电子系统实际上受到三个不同阶段的动态或振动环境的影响。第一阶段是在制造或筛选测试期间,第二阶段是在从组装到工厂到客户的运输过程中,最后阶段是在操作环境中。不同的部件,如电子元件和支撑结构,会发生随机振动,导致系统故障。由于整个电子元件都安装在由支撑结构支撑的底盘上,因此在暴露于振动环境时,确保其合理设计以抵抗动力效应至关重要。为了得到完整的系统模型,从而解决振动问题,需要分析完整系统的动力学和各层之间的相互作用。电子元件的设计是根据导弹的要求进行的。在本工程中,通过更换安装条和安装板来修改支撑结构。这些结构是通过整合杆和板来设计的。本项目的目的是设计这些结构,并在ANSYS中单独进行随机振动分析,分析随机振动对这些支撑结构的影响,并确定减少随机振动对电子元件影响的最佳支撑结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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