Temporary Bonding Using Paper Inserted PPC Layer

IF 0.6 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Informacije Midem-Journal of Microelectronics Electronic Components and Materials Pub Date : 2019-02-01 DOI:10.33180/InfMIDEM2018.403

Zhiyuan Zhu

引用次数: 1

Abstract

Temporary bonding using paper inserted polypropylene carbonate (PPC) layer is demonstrated. The inserted paper layer can absorb photo acid generator (PAG)-induced acid and protect the substrate. Large improvements of bonding strength are achieved using paper inserted PPC layer. Especially, the bonding strength is much higher than that of PPC/PAG-PPC bonding for tissue paper. The results show that the paper fibers can absorb decomposed PPC and PAG-induced acid, thus protecting the substrate

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临时粘接使用纸插入PPCLayer

介绍了用纸插式碳酸丙烯酯(PPC)层进行临时粘接的方法。插入的纸层可以吸收光酸发生器(PAG)诱导的酸，保护衬底。采用纸张插入PPC层可大大提高粘接强度。特别是，PPC/PAG-PPC对生活用纸的粘接强度远高于PPC/PAG-PPC。结果表明，纸纤维可以吸附分解的PPC和pag诱导的酸，从而保护底物

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Informacije Midem-Journal of Microelectronics Electronic Components and Materials 工程技术-材料科学：综合

CiteScore

1.80

自引率

0.00%

发文量

审稿时长

>12 weeks

期刊介绍： Informacije MIDEM publishes original research papers in the fields of microelectronics, electronic components and materials. Review papers are published upon invitation only. Scientific novelty and potential interest for a wider spectrum of readers is desired. Authors are encouraged to provide as much detail as possible for others to be able to replicate their results. Therefore, there is no page limit, provided that the text is concise and comprehensive, and any data that does not fit within a classical manuscript can be added as supplementary material. Topics of interest include: Microelectronics, Semiconductor devices, Nanotechnology, Electronic circuits and devices, Electronic sensors and actuators, Microelectromechanical systems (MEMS), Medical electronics, Bioelectronics, Power electronics, Embedded system electronics, System control electronics, Signal processing, Microwave and millimetre-wave techniques, Wireless and optical communications, Antenna technology, Optoelectronics, Photovoltaics, Ceramic materials for electronic devices, Thick and thin film materials for electronic devices.