Impact of Band Structure on Phonon-Limited Electron Mobility Behavior of Germanium-on-Insulator Layer with (001) and (111) Surfaces

IF 0.7 Q4 COMPUTER SCIENCE, INFORMATION SYSTEMS
Y. Omura, T. Yamamura, Shingo Sato
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引用次数: 0

Abstract

This paper studies the phonon-limited electron mobility of the inversion layer at room temperature for ultra-thin body (001) Ge and (111) Ge layers in single-gate (SG) and double-gate (DG) germanium-on-insulator (GOI) metal-oxide-semiconductor field-effect transistors (MOSFETs) aiming at future radio-frequency applications. Simulations are based on one-dimensional self-consistent calculations and relaxation time approximations. Assuming a 7.2-nm-thick GOI layer on (001) Ge surface, it has been demonstrated that intravalley phonon scattering in the DG GOI MOSFET inversion layer is strongly suppressed within a range of medium and high effective field values; DG GOI MOSFETs have higher phonon-limited electron mobility than SG GOI MOSFETs. The suppression of intra-valley-phonon scattering in a 7.2-nm-thick DG GOI MOSFET primarily stems from the reduction in the form factor at medium and high effective field values. However, it is shown that the use of the (001) Ge surface offers little merit in DG GOI MOSFETs because the mobility value is not large. It is demonstrated that the superior electron mobility on the (111) Ge surface of SG GOI MOSFETs confirms the significant merit of this structure with regard to applications because acoustic-phonon scattering events are significantly reduced in the non-degenerate L valley. Primary mechanism responsible for this fact is that some inter-subband form factors of electrons sharing the lowest subband of the non-degenerate L valley decrease at low effective field values, while the intra-subband form factor of electrons sharing the lowest subband of the non-degenerate L valley remains large. The expected phonon-limited electron mobility of SG GOI MOSFETs having a 4-nm-thick GOI layer, for example, with (111) Ge surface, is about 2300 cm2/V/s at the effective field of 0.5 MV/cm; this is about 400% of that of the equivalent SG GOI MOSFET with (001) Ge surface. Keywords— Electron mobility; Phonon scattering; Germanium; Germanium-on-insulator; MOSFET; Single-gate; Double-gate; Surface orientation.
带结构对(001)和(111)表面绝缘体上锗层声子限制电子迁移行为的影响
本文研究了单门(SG)和双门(DG)绝缘体上锗(GOI)金属氧化物半导体场效应晶体管(mosfet)中超薄体(001)Ge和(111)Ge层在室温下的声子限制电子迁移率。模拟是基于一维自洽计算和松弛时间近似。假设在(001)Ge表面有7.2 nm厚的GOI层,结果表明,在中、高有效场值范围内,DG GOI MOSFET反转层中的声子散射被强烈抑制;DG - GOI mosfet比SG - GOI mosfet具有更高的声子限制电子迁移率。在7.2 nm厚的DG - GOI MOSFET中,抑制谷内声子散射的主要原因是在中、高有效场值下减小了形状因子。然而,由于迁移率值不大,使用(001)Ge表面在DG - GOI mosfet中几乎没有什么优点。结果表明,SG - GOI mosfet (111) Ge表面优越的电子迁移率证实了该结构在应用方面的显著优点,因为在非简并L谷中声声子散射事件显着减少。造成这一现象的主要机制是,共享非简并L谷最低子带的电子的一些子带间形状因子在低有效场值时减小,而共享非简并L谷最低子带的电子的子带内形状因子仍然很大。在有效场为0.5 MV/cm时,具有4 nm厚GOI层的SG - GOI mosfet的声子限制电子迁移率约为2300 cm2/V/s,例如,表面为(111)Ge;这大约是具有(001)Ge表面的等效SG GOI MOSFET的400%。关键词:电子迁移率;声子散射;锗;Germanium-on-insulator;场效应晶体管;单扇;双栅;表面取向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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CiteScore
0.20
自引率
14.30%
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0
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