The effects of grain structure on electromigration failure of the lead-free solder bump

Q3 Engineering

International Journal for Engineering Modelling Pub Date : 2019-01-01 DOI:10.31534/ENGMOD.2018.3.RI.06D

Yuanxiang Zhang, L. Liang, Dongdong Zhu

引用次数: 1

Abstract

ENGINEERING MODELLING 31 (2018) 3, 79-93 79 The effects of grain structure on electromigration failure of the lead-free solder bump Yuanxiang Zhang(1), Lihua Liang(2), Dongdong Zhu(1) (1) Key Laboratory of Air-driven Equipment Technology of Zhejiang Province, Quzhou University, Quzhou 324000, CHINA e-mail: zhangyx@qzu.zj.cn (2) College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, CHINA

查看原文本刊更多论文

晶粒结构对无铅凸点电迁移失效的影响

张元祥(1)，梁丽华(2)，朱东东(1)(1)衢州学院气动装备技术浙江省重点实验室，浙江衢州324000 e-mail: zhangyx@qzu.zj.cn(2)浙江工业大学机械工程学院，浙江杭州310014

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

International Journal for Engineering Modelling Engineering-Mechanical Engineering

CiteScore

0.90

自引率

0.00%

发文量

期刊介绍： Engineering Modelling is a refereed international journal providing an up-to-date reference for the engineers and researchers engaged in computer aided analysis, design and research in the fields of computational mechanics, numerical methods, software develop-ment and engineering modelling.