Energy bandgap variation in semiconductor compound nanomaterials

IF 1.1 4区工程技术 Q4 Engineering

High Temperatures-high Pressures Pub Date : 2021-01-01 DOI:10.32908/hthp.v50.861

P. Chaturvedi, M. Goyal

引用次数: 0

Abstract

In the present work, we have used phenomological models for analyzing the impact of shape and size on energy band gap in semiconducting nanomaterial compounds. The models used presently are Qi model, Bond energy model and Guisbiers model. The extension of melting temperature expression for nanomaterials of the models considered is done and shape and size dependent expression of energy band gap is obtained. In this paper, we have taken group III-V semiconductor compound nanomaterials i.e., AlN, GaN, InN, GaAs and InAs. It is clear from the results obtained that decrease in the size of the semiconductor compound nanomaterials led to band gap expansion and this increase is significant for particle size below 5 nm. Comparison of the results predicted using different models with the available experimental and simulated results is done. Guisbiers model is found best out of the models considered to study the band gap expansion in semiconducting nanomaterial compounds. The energy band gap shift in valence and conduction band with size is determined in nanosemiconductors.

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半导体化合物纳米材料的能带变化

在目前的工作中，我们使用物候模型来分析半导体纳米材料化合物的形状和尺寸对能带隙的影响。目前使用的模型有Qi模型、Bond能模型和Guisbiers模型。对所考虑的模型中纳米材料的熔化温度表达式进行了推广，得到了能带隙随形状和尺寸的表达式。本文采用了III-V族半导体化合物纳米材料，即AlN、GaN、InN、GaAs和InAs。从结果可以清楚地看出，半导体化合物纳米材料尺寸的减小导致带隙的扩大，并且对于粒径小于5 nm的带隙的增加是显著的。将不同模型的预测结果与现有的实验和模拟结果进行了比较。Guisbiers模型被认为是研究半导体纳米材料中带隙扩展的最佳模型。测定了纳米半导体中价带和导带的能带隙随尺寸的变化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

High Temperatures-high Pressures THERMODYNAMICS-MECHANICS

CiteScore

1.00

自引率

9.10%

发文量

期刊介绍： High Temperatures – High Pressures (HTHP) is an international journal publishing original peer-reviewed papers devoted to experimental and theoretical studies on thermophysical properties of matter, as well as experimental and modelling solutions for applications where control of thermophysical properties is critical, e.g. additive manufacturing. These studies deal with thermodynamic, thermal, and mechanical behaviour of materials, including transport and radiative properties. The journal provides a platform for disseminating knowledge of thermophysical properties, their measurement, their applications, equipment and techniques. HTHP covers the thermophysical properties of gases, liquids, and solids at all temperatures and under all physical conditions, with special emphasis on matter and applications under extreme conditions, e.g. high temperatures and high pressures. Additionally, HTHP publishes authoritative reviews of advances in thermophysics research, critical compilations of existing data, new technology, and industrial applications, plus book reviews.