Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads

Q4 Engineering
S. Mathew, D. Das, M. Osterman, M. Pecht, R. Ferebee, J. Clayton
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引用次数: 29

Abstract

This study presents a physics-of-failure-based virtual remaining life assessment method for assessing the remaining life of an electronic circuit card. The approach is then demonstrated through a case study of a circuit card assembly in the Space Shuttle solid rocket booster. Using thermal and mechanical stress damage models, the accumulated damage in the circuit card due to the life cycle environment loads on the card was calculated. Based on the amount of damage accumulated, the remaining life of the circuit card was estimated.
冲击和随机振动寿命周期载荷下电子硬件的虚拟剩余寿命评估
本研究提出了一种基于故障物理的虚拟剩余寿命评估方法,用于评估电子电路卡的剩余寿命。然后通过航天飞机固体火箭助推器中的电路卡组件的案例研究证明了该方法。采用热应力和机械应力损伤模型,计算了电路卡在生命周期环境载荷作用下的累积损伤。根据累积的损坏量,估计电路卡的剩余寿命。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of the IEST
Journal of the IEST Engineering-Safety, Risk, Reliability and Quality
CiteScore
0.40
自引率
0.00%
发文量
0
期刊介绍: The Journal of the IEST is an official publication of the Institute of Environmental Sciences and Technology and is of archival quality and noncommercial in nature. It was established to advance knowledge through technical articles selected by peer review, and has been published for over 50 years as a benefit to IEST members and the technical community at large as as a permanent record of progress in the science and technology of the environmental sciences
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