Structural, electrical, and thermistor behavior of BiFeO3-PbZrO3 for energy storage devices

IF 1.3 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
P. Mallick, S. Biswal, S. K. Satpathy, B. Behera
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引用次数: 2

Abstract

The solid-state reaction technique is used to prepare the samples 0.3(BiFeO3)–0.7(PbZrO3) and 0.5(BiFeO3)–0.5(PbZrO3). Structural parameters including percent crystallinity, dislocation density, microstrain, and the average size of crystallites are calculated using the X-Ray Diffraction (XRD) data at room temperature. The SEM micrographs reveal the spherical, densely packed natures of the samples with low porosity. Dielectric constant and dielectric loss increases with the rising content of Bismuth ferrite in the materials. The performance of the materials as an NTC thermistor in the temperature range 300–450°C is discussed. The values of the Thermistor constant (i.e. in the range of 3911–6247K) and the range of sensitivity index (−1 to −9%) confirmed the potential use of the samples as NTC thermistors. The frequency-dependent ac conductivity satisfies the universal Jonscher power law. The high density of states is determined from the frequency and temperature-dependent ac conductivity of the materials.
用于储能器件的BiFeO3-PbZrO3的结构、电学和热敏电阻行为
采用固相反应技术制备了0.3(BiFeO3) -0.7 (PbZrO3)和0.5(BiFeO3) -0.5 (PbZrO3)样品。利用室温下的x射线衍射(XRD)数据计算了晶体的结晶度、位错密度、微应变和平均尺寸等结构参数。SEM显微图显示了低孔隙率样品的球形、密集堆积性质。随着铁氧体铋含量的增加,材料的介电常数和介电损耗增大。讨论了该材料在300-450℃范围内作为NTC热敏电阻的性能。热敏电阻常数的值(即在3911-6247K范围内)和灵敏度指数的范围(- 1至- 9%)证实了样品作为NTC热敏电阻的潜在用途。频率相关的交流电导率满足普遍的琼舍尔幂律。状态的高密度由材料的频率和温度相关的交流电导率决定。
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来源期刊
Emerging Materials Research
Emerging Materials Research MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
4.50
自引率
9.10%
发文量
62
期刊介绍: Materials Research is constantly evolving and correlations between process, structure, properties and performance which are application specific require expert understanding at the macro-, micro- and nano-scale. The ability to intelligently manipulate material properties and tailor them for desired applications is of constant interest and challenge within universities, national labs and industry.
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