Novel Cement-Ceramic Encapsulation Material for Electronic Packaging

IF 0.5 4区材料科学 Q4 MATERIALS SCIENCE, CERAMICS

Journal of Ceramic Science and Technology Pub Date : 2018-01-01 DOI:10.15496/PUBLIKATION-31007

Stefan Käßner, Nadja Wichtner, C. Berthold, K. Nickel

引用次数: 7

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新型电子封装水泥陶瓷封装材料

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来源期刊

Journal of Ceramic Science and Technology MATERIALS SCIENCE, CERAMICS-

CiteScore

0.80

自引率

0.00%

发文量

期刊介绍： The Journal of Ceramic Science and Technology publishes original scientific articles on all topics of ceramic science and technology from all ceramic branches. The focus is on the scientific exploration of the relationships between processing, microstructure and properties of sintered ceramic materials as well as on new processing routes for innovative ceramic materials. The papers may have either theoretical or experimental background. A high quality of publications will be guaranteed by a thorough double blind peer review process.