Study on the abrasion mechanism of ultraviolet cured resin bond diamond wheel

Abstract

Based on an extensive review of traditional machining technologies, a novel method to manufacture abrasive tools using ultraviolet (UV) light curing technique was proposed to achieve the economy and accuracy for machining ceramic materials. The UV cured resin bond tools have been proven to have substantial advantages in machining performance. However, there has been limited research on the abrasion mechanism of such tools. In this paper, the mechanism of such resin bond tools is proposed as a hybrid of conventional grinding and lapping, and called as a grinding/lapping (G/L) process. In order to verify the proposed mechanism, three resin bond diamond wheels cured by UV light were used to conduct lapping, grinding, and G/L process, respectively, under the same experimental set-up. The experimental results like surface roughness (RA) and surface profiles of the workpieces undertaking the three operations were compared and showed good agreement with the proposed mechanism.