{"title":"Topology optimisation design of mechanical tee backsheet","authors":"Jinlong Wang, Junlong Chen","doi":"10.1504/IJRS.2019.10017888","DOIUrl":null,"url":null,"abstract":"A finite element model of ASTM 114.3 mechanical tee backsheet is established by using the finite element software ANSYS. The stress distribution of backsheet under pretension force load is obtained through the strength analysis, and based on it, a topology optimisation calculations of backsheet is analysed. According to the topology optimisation results, the backsheet structure is redesigned and the finite element analysis to it shows that reducing the volume of the model of the backsheet while improving its stress distribution, the maximum equivalent stress is reduced and the enhanced chip reliability.","PeriodicalId":39031,"journal":{"name":"International Journal of Reliability and Safety","volume":"1 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Reliability and Safety","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1504/IJRS.2019.10017888","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0
Abstract
A finite element model of ASTM 114.3 mechanical tee backsheet is established by using the finite element software ANSYS. The stress distribution of backsheet under pretension force load is obtained through the strength analysis, and based on it, a topology optimisation calculations of backsheet is analysed. According to the topology optimisation results, the backsheet structure is redesigned and the finite element analysis to it shows that reducing the volume of the model of the backsheet while improving its stress distribution, the maximum equivalent stress is reduced and the enhanced chip reliability.