Topology optimisation design of mechanical tee backsheet

Q2 Engineering
Jinlong Wang, Junlong Chen
{"title":"Topology optimisation design of mechanical tee backsheet","authors":"Jinlong Wang, Junlong Chen","doi":"10.1504/IJRS.2019.10017888","DOIUrl":null,"url":null,"abstract":"A finite element model of ASTM 114.3 mechanical tee backsheet is established by using the finite element software ANSYS. The stress distribution of backsheet under pretension force load is obtained through the strength analysis, and based on it, a topology optimisation calculations of backsheet is analysed. According to the topology optimisation results, the backsheet structure is redesigned and the finite element analysis to it shows that reducing the volume of the model of the backsheet while improving its stress distribution, the maximum equivalent stress is reduced and the enhanced chip reliability.","PeriodicalId":39031,"journal":{"name":"International Journal of Reliability and Safety","volume":"1 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Reliability and Safety","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1504/IJRS.2019.10017888","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

Abstract

A finite element model of ASTM 114.3 mechanical tee backsheet is established by using the finite element software ANSYS. The stress distribution of backsheet under pretension force load is obtained through the strength analysis, and based on it, a topology optimisation calculations of backsheet is analysed. According to the topology optimisation results, the backsheet structure is redesigned and the finite element analysis to it shows that reducing the volume of the model of the backsheet while improving its stress distribution, the maximum equivalent stress is reduced and the enhanced chip reliability.
机械三通背板拓扑优化设计
利用有限元软件ANSYS建立了ASTM 114.3机械三通背板的有限元模型。通过强度分析,得到了预紧力载荷作用下背板的应力分布,并在此基础上分析了背板的拓扑优化计算。根据拓扑优化结果,对背板结构进行了重新设计,并对其进行了有限元分析,结果表明,在减小背板模型体积的同时,改善了背板的应力分布,减小了最大等效应力,提高了芯片的可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
International Journal of Reliability and Safety
International Journal of Reliability and Safety Engineering-Safety, Risk, Reliability and Quality
CiteScore
1.00
自引率
0.00%
发文量
1
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