{"title":"Improvement of isothermal characteristic of isothermal chamber by filling with graded copper foam","authors":"Hangming Shen, Lihong Yang","doi":"10.1299/jtst.22-00397","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":17405,"journal":{"name":"Journal of Thermal Science and Technology","volume":"165 1","pages":""},"PeriodicalIF":1.2000,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Thermal Science and Technology","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1299/jtst.22-00397","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"THERMODYNAMICS","Score":null,"Total":0}
期刊介绍:
JTST covers a variety of fields in thermal engineering including heat and mass transfer, thermodynamics, combustion, bio-heat transfer, micro- and macro-scale transport phenomena and practical thermal problems in industrial applications.