Cyclic Voltammetric Study of High Speed Silver Electrodeposition and Dissolution in Low Cyanide Solutions

IF 2.3 Q3 ELECTROCHEMISTRY
Bo Zheng, L. Wong, L. Wu, Zhongxiu Chen
{"title":"Cyclic Voltammetric Study of High Speed Silver Electrodeposition and Dissolution in Low Cyanide Solutions","authors":"Bo Zheng, L. Wong, L. Wu, Zhongxiu Chen","doi":"10.1155/2016/4318178","DOIUrl":null,"url":null,"abstract":"The electrochemical processes in solutions with a much lower amount of free cyanide (<10 g/L KCN) than the conventional alkaline silver electrolytes were first explored by using cyclic voltammetry. The electrochemical behavior and the effect of KAg(CN)2, KCN, and KNO3 electrolytes and solution pH on the electrodeposition and dissolution processes were investigated. Moreover, suitable working conditions for high speed, low cyanide silver electrodeposition were also proposed. Both silver and cyanide ions concentration had significant effects on the electrode polarization and deposition rate. The onset potential of silver electrodeposition could be shifted to more positive values by using solutions containing higher silver and lower KCN concentration. Higher silver concentration also led to higher deposition rate. Besides maintaining high conductivity of the solution, KNO3 might help reduce the operating current density required for silver electrodeposition at high silver concentration albeit at the expense of slowing down the electrodeposition rate. The silver dissolution consists of a limiting step and the reaction rate depends on the amount of free cyanide ions. The surface and material characteristics of Ag films deposited by low cyanide solution are also compared with those deposited by conventional high cyanide solution.","PeriodicalId":13933,"journal":{"name":"International journal of electrochemistry","volume":"2016 1","pages":"1-11"},"PeriodicalIF":2.3000,"publicationDate":"2016-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1155/2016/4318178","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International journal of electrochemistry","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1155/2016/4318178","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ELECTROCHEMISTRY","Score":null,"Total":0}
引用次数: 10

Abstract

The electrochemical processes in solutions with a much lower amount of free cyanide (<10 g/L KCN) than the conventional alkaline silver electrolytes were first explored by using cyclic voltammetry. The electrochemical behavior and the effect of KAg(CN)2, KCN, and KNO3 electrolytes and solution pH on the electrodeposition and dissolution processes were investigated. Moreover, suitable working conditions for high speed, low cyanide silver electrodeposition were also proposed. Both silver and cyanide ions concentration had significant effects on the electrode polarization and deposition rate. The onset potential of silver electrodeposition could be shifted to more positive values by using solutions containing higher silver and lower KCN concentration. Higher silver concentration also led to higher deposition rate. Besides maintaining high conductivity of the solution, KNO3 might help reduce the operating current density required for silver electrodeposition at high silver concentration albeit at the expense of slowing down the electrodeposition rate. The silver dissolution consists of a limiting step and the reaction rate depends on the amount of free cyanide ions. The surface and material characteristics of Ag films deposited by low cyanide solution are also compared with those deposited by conventional high cyanide solution.
循环伏安法研究银在低氰溶液中的高速电沉积和溶解
采用循环伏安法研究了游离氰化物(<10 g/L KCN)含量远低于碱性银电解质的电化学过程。研究了KAg(CN)2、KCN和KNO3电解质的电化学行为以及溶液pH对电沉积和溶解过程的影响。此外,还提出了适合高速低氰银电沉积的工作条件。银离子浓度和氰化物离子浓度对电极极化和沉积速率均有显著影响。高银低KCN溶液可使银电沉积的起始电位向正电位偏移。银浓度越高,沉积速率越快。除了保持溶液的高导电性外,KNO3可能有助于降低在高银浓度下银电沉积所需的工作电流密度,尽管以减慢电沉积速率为代价。银的溶解包括一个限制步骤,反应速率取决于游离氰化物离子的量。并比较了低氰溶液沉积的银膜与常规高氰溶液沉积的银膜的表面和材料特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
2
审稿时长
7 weeks
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信