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Effect of Seed Layer Thickness Distribution on 3D Integrated Through-Silicon-Vias (TSVs) Filling Model

ECS Electrochemistry Letters Pub Date : 2015-01-01 DOI:10.1149/2.0111506EEL
Yazhou Zhang, G. Ding, Hong Wang, P. Cheng, Jiangbo Luo
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种子层厚度分布对三维集成硅孔(tsv)填充模型的影响
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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来源期刊
ECS Electrochemistry Letters
ECS Electrochemistry Letters ELECTROCHEMISTRY-MATERIALS SCIENCE, MULTIDISCIPLINARY
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