Experimental Study on Pressure Drop Characteristics of Vents

G. Dhanushkodi
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引用次数: 5

Abstract

One of the major impacts on the thermal design of electronic systems over the past decade has been the use of computational fluid dynamics and heat transfer tools. System level thermal simulation has driven the need to understand the performance and the reliability aspects of boundary conditions. In addition to the modeling inaccuracies, computation results also reflect the influence of the accuracy of input parameters. The computational fluid dynamics model of electronic enclosures requires the pressure drop details of vents to predict the system impedance and air flow through the system thereafter. The temperature of electronic components depends on the rate of airflow through the electronic system. Loss coefficient of vents appears to be the major source of error. The modeling of each vent is typically not possible and is represented by its pressure drop. An experimental setup is established to measure the pressure drop characteristics of different patterns of vents commonly used in electronic equipment. Pressure drop of different vent patterns, with hole diameter varying from 1.6 mm to 3.0 mm, the pitch varying from 3.2 mm to 6.5 mm, and the porosity varying from 20% to 45%, are measured using an experimental setup. In this paper, a practical formula for the loss coefficient of vents is presented. This formula takes into account important parameters such as hole diameter, pitch, porosity, and Reynolds number.
通风口压降特性的实验研究
在过去的十年中,对电子系统热设计的主要影响之一是计算流体动力学和传热工具的使用。系统级热模拟驱动了理解边界条件的性能和可靠性方面的需求。除建模误差外,计算结果还反映了输入参数精度的影响。电子机箱的计算流体动力学模型需要通风口的压降细节来预测系统阻抗和此后通过系统的气流。电子元件的温度取决于通过电子系统的气流速率。通风口的损失系数似乎是误差的主要来源。每个通风口的建模通常是不可能的,并且由其压降表示。建立了一种实验装置,对电子设备中常用的不同型式通风口的压降特性进行了测量。采用实验装置,对孔径为1.6 ~ 3.0 mm、节距为3.2 ~ 6.5 mm、孔隙度为20% ~ 45%的不同排气孔模式下的压降进行了测量。本文给出了通风口损失系数的实用计算公式。该公式考虑了一些重要参数,如孔径、节距、孔隙度和雷诺数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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