Numerical Study of Free Convection Dominated Melting in an Isolated Cavity Heated by Three Protruding Electronic Components

M. Faraji, H. El Qarnia
{"title":"Numerical Study of Free Convection Dominated Melting in an Isolated Cavity Heated by Three Protruding Electronic Components","authors":"M. Faraji, H. El Qarnia","doi":"10.1109/TCAPT.2009.2029086","DOIUrl":null,"url":null,"abstract":"This paper presents the results of a numerical study of the melting and natural convection in a rectangular enclosure heated with three discrete protruding electronic components (heat sources) mounted on a conducting vertical plate. The heat sources generate heat at a constant and uniform volumetric rate. A part of the power generated in the heat sources is dissipated in phase change material (PCM, n-eicosane with melting temperature, Tm = 36°C) that filled the enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic components without activating the fan. To investigate the thermal behavior of the proposed cooling system, a mathematical model, based on the mass, momentum, and energy conservation equations, was developed. The governing equations are next discretized using a finite volume method in a staggered mesh, and a pressure correction equation method is employed for the pressure-velocity coupling. The energy conservation equation for the PCM is solved using the enthalpy method. The solid regions (substrate and heat sources) are treated as fluid regions with infinite viscosity. A parametric study was conducted in order to optimize the thermal performance of the heat sink. The optimization involves determination of the key parameter values that maximize the time required by the electronic component to reach the critical temperature (T < Tcr).","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"167-177"},"PeriodicalIF":0.0000,"publicationDate":"2010-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2009.2029086","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components and Packaging Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TCAPT.2009.2029086","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13

Abstract

This paper presents the results of a numerical study of the melting and natural convection in a rectangular enclosure heated with three discrete protruding electronic components (heat sources) mounted on a conducting vertical plate. The heat sources generate heat at a constant and uniform volumetric rate. A part of the power generated in the heat sources is dissipated in phase change material (PCM, n-eicosane with melting temperature, Tm = 36°C) that filled the enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic components without activating the fan. To investigate the thermal behavior of the proposed cooling system, a mathematical model, based on the mass, momentum, and energy conservation equations, was developed. The governing equations are next discretized using a finite volume method in a staggered mesh, and a pressure correction equation method is employed for the pressure-velocity coupling. The energy conservation equation for the PCM is solved using the enthalpy method. The solid regions (substrate and heat sources) are treated as fluid regions with infinite viscosity. A parametric study was conducted in order to optimize the thermal performance of the heat sink. The optimization involves determination of the key parameter values that maximize the time required by the electronic component to reach the critical temperature (T < Tcr).
由三个突出的电子元件加热的隔离腔内自由对流主导熔化的数值研究
本文给出了由安装在导电垂直板上的三个分立的突出电子元件(热源)加热的矩形外壳内熔化和自然对流的数值研究结果。热源以恒定和均匀的体积率产生热量。在热源中产生的一部分能量在充满外壳的相变材料(PCM,熔化温度为Tm = 36°C的n-二十烷)中消散。使用这种冷却策略的优点是pcm能够在不激活风扇的情况下吸收电子元件产生的大量热量。为了研究所提出的冷却系统的热行为,建立了一个基于质量、动量和能量守恒方程的数学模型。采用有限体积法在交错网格中离散控制方程,并采用压力修正方程法求解压力-速度耦合。用焓法求解了相变介质的能量守恒方程。固体区域(基材和热源)被视为具有无限粘度的流体区域。为了优化散热器的热性能,进行了参数化研究。优化包括确定关键参数值,使电子元件达到临界温度(T < Tcr)所需的时间最大化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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