Investigation of the mechanical characteristics of the Cu/low-k BEOL under wire bonding process loading

IF 1.5 4区 工程技术 Q3 MECHANICS
Cadmus C A Yuan, H. M. Chang, K. Chiang
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引用次数: 2

Abstract

Wire bonding is a key integrated circuit (IC) interconnect technology, and it adheres metal wires to the IC pad and substrate by applying significant compression and energic loading. On the other hand, the Cu/low-k technology of the advanced IC industry is driven by the market demands of small size, and low resistance-capacitance delay applications. Because material properties of Cu/low-k back end of line (BEOL) exhibit significant differences from the conventional Al-based system, 3 new reliability failure modes are introduced after the wire bonding process, including the Al pad lift, Cu pad lift and the nanoscaled Cu diffusion barrier crack. To study the mechanical characteristics of the Cu/low-k BEOL under the wire bonding process loading, this research establishes a set of transient numerical models with mesh control and computation acceleration techniques. The mechanical characteristics of the wire bonding process and the differences between the conventional and Cu/low-k BEOLs are analyzed via the detailed analysis of the historical stress plots over the wire bonding process time. Moreover, the risks of wire bonding induced the failure modes against different Cu/low-k designs are studied by the proper mechanical indices, and optimized design trends are suggested.
Cu/low-k BEOL在线接过程载荷下的力学特性研究
线键合是一种关键的集成电路互连技术,它通过施加显著的压缩和能量负载将金属导线粘接在IC衬垫和衬底上。另一方面,先进集成电路产业的Cu/low-k技术是由小尺寸、低阻容延迟应用的市场需求驱动的。由于Cu/低k后端线(BEOL)的材料性能与传统Al基系统存在显著差异,因此引入了Al焊盘抬升、Cu焊盘抬升和纳米级Cu扩散势垒裂纹3种新型可靠性失效模式。为了研究Cu/low-k BEOL在线接过程载荷下的力学特性,本研究建立了一套采用网格控制和计算加速技术的瞬态数值模型。通过详细分析金属丝键合过程的历史应力图,分析了金属丝键合过程的力学特性以及传统与Cu/低k BEOLs之间的差异。此外,通过适当的力学指标,研究了不同铜/低钾设计下焊丝键合失效模式的风险,并提出了优化设计趋势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Mechanics
Journal of Mechanics 物理-力学
CiteScore
3.20
自引率
11.80%
发文量
20
审稿时长
6 months
期刊介绍: The objective of the Journal of Mechanics is to provide an international forum to foster exchange of ideas among mechanics communities in different parts of world. The Journal of Mechanics publishes original research in all fields of theoretical and applied mechanics. The Journal especially welcomes papers that are related to recent technological advances. The contributions, which may be analytical, experimental or numerical, should be of significance to the progress of mechanics. Papers which are merely illustrations of established principles and procedures will generally not be accepted. Reports that are of technical interest are published as short articles. Review articles are published only by invitation.
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