The Electrodeposition of Nickel, Solderable and Wear-resistant Nickel-Boron Alloys from Low Concentrated Colloid-Electrolytes

IF 1.2 4区 材料科学 Q4 ELECTROCHEMISTRY
L. A. Degtjar, B. U. Dubov, I. D. Kudrjavtzeva, F. I. Kukos
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引用次数: 4

Abstract

Some aspects of nickel and nickel-boron alloys plating from low concentrated chloride colloid-electrolyte baths have been investigated. The nature of particles being reduced and the reason for the marked increase in rate of the electrodeposition are discussed. X-ray analysis suggests that the reason for the high and stable solderability of nickel-boron alloys is the presence in the structure of (Ni 3 B).O and (Ni 3 B).16O phases. The phase Ni 4 B 3 is assumed to increase the resistance to wear.
低浓度胶体电解液电沉积镍、可焊及耐磨镍硼合金
本文研究了低浓度氯化物胶体-电解液镀镍及镍硼合金的若干问题。讨论了被还原颗粒的性质和电沉积速率显著提高的原因。x射线分析表明,镍硼合金具有高而稳定的可焊性的原因是(ni3b) o和(ni3b) 16o相结构的存在。假定相ni4b3增加了耐磨性。
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来源期刊
Transactions of The Institute of Metal Finishing
Transactions of The Institute of Metal Finishing 工程技术-材料科学:膜
CiteScore
3.40
自引率
10.50%
发文量
62
审稿时长
3 months
期刊介绍: Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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