{"title":"The Role of Cu(I) in the Process of Forming Cu2–xS Coatings by a Chemical Route","authors":"J. Vinkevičius, G. Valiulienė, A. Žielienė","doi":"10.1080/00202967.1999.11871256","DOIUrl":null,"url":null,"abstract":"The interaction of the Cu 2 O adsorbed with Na 2 S n (n = 1-4 ), during formation of the Cu 2-x S coatings has been investigated by cyclic voltammetry. The summarized reaction of this process has been shown to correspond to the equation: Na 2 S + Cu 2 O ad + H 2 O → Cu 2 S ad + (n-1)S 0 + 2NaOH, where S 0 /Cu=(n 1)/2. Such a stoichiometry of reaction ca be explained by the formation of an intermediate the adsorbed polysulphide of Cu(1) and by its subsequent decomposition into Cu 2 S and S 0 . When a thicker coating is being formed, i.e., when the surface being coated is repeatedly immersed into an ammoniate solution of Cu (1) and S 0 fully bounded: S 0 ad + 2Cu + → CuS + Cu 2 + . At the same time due to different solubility products (L=2.5-10 and 6.3-10 for Cu 2 S and CuS respectively), an exchange CuS ad + 2 (1-x)Cy + →Cu 2-x S ad +(1-x)Cu 2+ occurs. After formation of Cu 2+ . parallel processes characteristic for the interaction of Cu(II) with Na 2 S n start to take place, during which S is also formed.","PeriodicalId":23268,"journal":{"name":"Transactions of The Institute of Metal Finishing","volume":"77 1","pages":"91-94"},"PeriodicalIF":1.2000,"publicationDate":"1999-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00202967.1999.11871256","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transactions of The Institute of Metal Finishing","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/00202967.1999.11871256","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ELECTROCHEMISTRY","Score":null,"Total":0}
引用次数: 6
Abstract
The interaction of the Cu 2 O adsorbed with Na 2 S n (n = 1-4 ), during formation of the Cu 2-x S coatings has been investigated by cyclic voltammetry. The summarized reaction of this process has been shown to correspond to the equation: Na 2 S + Cu 2 O ad + H 2 O → Cu 2 S ad + (n-1)S 0 + 2NaOH, where S 0 /Cu=(n 1)/2. Such a stoichiometry of reaction ca be explained by the formation of an intermediate the adsorbed polysulphide of Cu(1) and by its subsequent decomposition into Cu 2 S and S 0 . When a thicker coating is being formed, i.e., when the surface being coated is repeatedly immersed into an ammoniate solution of Cu (1) and S 0 fully bounded: S 0 ad + 2Cu + → CuS + Cu 2 + . At the same time due to different solubility products (L=2.5-10 and 6.3-10 for Cu 2 S and CuS respectively), an exchange CuS ad + 2 (1-x)Cy + →Cu 2-x S ad +(1-x)Cu 2+ occurs. After formation of Cu 2+ . parallel processes characteristic for the interaction of Cu(II) with Na 2 S n start to take place, during which S is also formed.
期刊介绍:
Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.